CY7C1484V33-200BGC vs K7N641845M-QI250 feature comparison

CY7C1484V33-200BGC Cypress Semiconductor

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K7N641845M-QI250 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA QFP
Package Description BGA, BGA119,7X17,50 LQFP, QFP100,.63X.87
Pin Count 119 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 2.6 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz 250 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B119 R-PQFP-G100
Length 22 mm 20 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 2097152 words 4194304 words
Number of Words Code 2000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36 4MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Equivalence Code BGA119,7X17,50 QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.6 mm
Standby Voltage-Min 3.14 V 2.38 V
Supply Voltage-Max (Vsup) 3.465 V 2.625 V
Supply Voltage-Min (Vsup) 3.135 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

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