CY7C1484V33-200BGC vs GS8642Z36F-300 feature comparison

CY7C1484V33-200BGC Cypress Semiconductor

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GS8642Z36F-300 GSI Technology

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description BGA, BGA119,7X17,50 BGA,
Pin Count 119 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 5.5 ns
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B165
Length 22 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX36 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm
Standby Voltage-Min 3.14 V
Supply Voltage-Max (Vsup) 3.465 V 2.7 V
Supply Voltage-Min (Vsup) 3.135 V 2.3 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm
Base Number Matches 1 4
Pbfree Code No
Rohs Code No
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 235

Compare CY7C1484V33-200BGC with alternatives

Compare GS8642Z36F-300 with alternatives