CY7C1482BV33-167BZC
vs
CY7C1472BV25-200AXC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INFINEON TECHNOLOGIES AG
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
3.4 ns
3 ns
Clock Frequency-Max (fCLK)
167 MHz
200 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
JESD-609 Code
e0
e3
Memory Density
75497472 bit
75497472 bit
Memory IC Type
STANDARD SRAM
ZBT SRAM
Memory Width
18
18
Number of Terminals
165
100
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4MX18
4MX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LQFP
Package Equivalence Code
BGA165,11X15,40
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
3.14 V
2.38 V
Supply Current-Max
0.45 mA
0.45 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Matte Tin (Sn)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Base Number Matches
1
2
Package Description
14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Factory Lead Time
11 Weeks
Additional Feature
PIPELINED ARCHITECTURE
Length
20 mm
Moisture Sensitivity Level
3
Number of Functions
1
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
Width
14 mm
Compare CY7C1482BV33-167BZC with alternatives
Compare CY7C1472BV25-200AXC with alternatives