CY7C1480V33-167BZC
vs
K7N643645M-QC250
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
QFP
Package Description
15 X 17 MM, 1.40 MM HEIGHT, FBGA-165
LQFP, QFP100,.63X.87
Pin Count
165
100
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.4 ns
2.6 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
167 MHz
250 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
JESD-609 Code
e0
e0
Length
17 mm
20 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX36
2MX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LQFP
Package Equivalence Code
BGA165,11X15,40
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.6 mm
Standby Voltage-Min
3.14 V
2.38 V
Supply Voltage-Max (Vsup)
3.6 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
14 mm
Base Number Matches
1
1
Compare CY7C1480V33-167BZC with alternatives
Compare K7N643645M-QC250 with alternatives