CY7C1480V33-167BGC vs GS8642ZV36F-300T feature comparison

CY7C1480V33-167BGC Cypress Semiconductor

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GS8642ZV36F-300T GSI Technology

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 BGA,
Pin Count 119 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.4 ns 5.5 ns
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B165
Length 22 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX36 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm
Standby Voltage-Min 3.14 V
Supply Voltage-Max (Vsup) 3.465 V 2 V
Supply Voltage-Min (Vsup) 3.135 V 1.6 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 235

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Compare GS8642ZV36F-300T with alternatives