CY7C1480BV33-200BZC
vs
CY7C1395V25-166AC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3 ns
3.5 ns
Clock Frequency-Max (fCLK)
200 MHz
166 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
JESD-609 Code
e0
e0
Memory Density
75497472 bit
75497472 bit
Memory IC Type
STANDARD SRAM
ZBT SRAM
Memory Width
36
36
Number of Terminals
165
100
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX36
2MX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LQFP
Package Equivalence Code
BGA165,11X15,40
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
3.14 V
2.38 V
Supply Current-Max
0.5 mA
0.22 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
1
1
Pbfree Code
Part Package Code
QFP
Package Description
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Pin Count
100
Additional Feature
PIPELINE ARCHITECTURE
Length
20 mm
Moisture Sensitivity Level
3
Number of Functions
1
Seated Height-Max
1.6 mm
Standby Current-Max
0.02 A
Supply Voltage-Max (Vsup)
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
Width
14 mm
Compare CY7C1480BV33-200BZC with alternatives
Compare CY7C1395V25-166AC with alternatives