CY7C148-45DMB
vs
AM2148-35LCB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MSIS SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP, DIP18,.3
QCCN, LCC18,.3X.35
Pin Count
18
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
35 ns
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T18
R-XQCC-N18
JESD-609 Code
e0
e0
Length
22.606 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
Number of Ports
1
Number of Terminals
18
18
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
1KX4
1KX4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
QCCN
Package Equivalence Code
DIP18,.3
LCC18,.3X.35
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.11 mA
0.18 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
MOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
Base Number Matches
2
2
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