CY7C1475V25-133BGXC
vs
CY7C1475V25-133BGXI
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209
|
14 X 22 MM, 1.76 MM HEIGHT, LEAD FREE, FBGA-209
|
Pin Count |
209
|
209
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
6.5 ns
|
6.5 ns
|
Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
FLOW-THROUGH ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
133 MHz
|
133 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PBGA-B209
|
R-PBGA-B209
|
JESD-609 Code |
e1
|
e1
|
Length |
22 mm
|
22 mm
|
Memory Density |
75497472 bit
|
75497472 bit
|
Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
Memory Width |
72
|
72
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
209
|
209
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
1MX72
|
1MX72
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA209,11X19,40
|
BGA209,11X19,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.96 mm
|
1.96 mm
|
Standby Voltage-Min |
2.38 V
|
2.38 V
|
Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
20
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CY7C1475V25-133BGXC with alternatives
Compare CY7C1475V25-133BGXI with alternatives