CY7C1474V25-250BGC vs GS8644V72C-200 feature comparison

CY7C1474V25-250BGC Cypress Semiconductor

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GS8644V72C-200 GSI Technology

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 14 X 22 MM, 1.76 MM HEIGHT, FBGA-209 LBGA,
Pin Count 209 209
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 6.5 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED OR FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK) 250 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B209 R-PBGA-B209
JESD-609 Code e0
Length 22 mm 22 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM CACHE SRAM
Memory Width 72 72
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX72 1MX72
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA209,11X19,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.96 mm 1.7 mm
Standby Voltage-Min 2.38 V
Supply Voltage-Max (Vsup) 2.625 V 2 V
Supply Voltage-Min (Vsup) 2.375 V 1.6 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220

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