CY7C1474BV33-167BGC
vs
GS864272GC-250VT
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
GSI TECHNOLOGY
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
14 X 22 MM, 1.76 MM HEIGHT, FBGA-209
|
LBGA,
|
| Pin Count |
209
|
209
|
| Reach Compliance Code |
unknown
|
compliant
|
| Access Time-Max |
3.4 ns
|
6.5 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
|
| JESD-30 Code |
R-PBGA-B209
|
R-PBGA-B209
|
| Length |
22 mm
|
22 mm
|
| Memory Density |
75497472 bit
|
75497472 bit
|
| Memory IC Type |
ZBT SRAM
|
CACHE SRAM
|
| Memory Width |
72
|
72
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
209
|
209
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1MX72
|
1MX72
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.96 mm
|
1.7 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
2 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
NOT SPECIFIED
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
3A991.B.2.A
|
| HTS Code |
|
8542.32.00.41
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
|
|
|
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