CY7C1473BV25-100BZI vs GS8641Z18F-300I feature comparison

CY7C1473BV25-100BZI Cypress Semiconductor

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GS8641Z18F-300I GSI Technology

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 BGA,
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8.5 ns 5.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX18 4MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.12 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.275 mA
Supply Voltage-Max (Vsup) 2.625 V 2.7 V
Supply Voltage-Min (Vsup) 2.375 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm
Base Number Matches 1 2
Pbfree Code No
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 235

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