CY7C1472V25-200BZI vs CY7C1472BV25-200AXCT feature comparison

CY7C1472V25-200BZI Cypress Semiconductor

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CY7C1472BV25-200AXCT Infineon Technologies AG

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP INFINEON TECHNOLOGIES AG
Part Package Code BGA
Package Description 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100
Pin Count 165
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Category CO2 Kg 12 12
Compliance Temperature Grade Industrial: -40C to +85C Commercial: +0C to +70C
Candidate List Date 2018-06-27 2024-06-27
SVHC Over MCV 7439-92-1
EFUP 50 e
Conflict Mineral Status DRC Conflict Free Undeterminable DRC Conflict Free
Conflict Mineral Status Source Conflict Minerals Statement CMRT V6.22
Access Time-Max 3 ns 3 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz 200 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PQFP-G100
JESD-609 Code e0 e4
Length 17 mm 20 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4MX18 4MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LQFP
Package Equivalence Code BGA165,11X15,40 QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.6 mm
Standby Voltage-Min 2.38 V 2.38 V
Supply Voltage-Max (Vsup) 2.625 V 2.625 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 15 mm 14 mm
Base Number Matches 1 2
Factory Lead Time 11 Weeks
kg CO2e/kg 12
Average Weight (mg) 499.175
CO2e (mg) 5990.1
Total Weight 887
CO2 10644
EU RoHS Version RoHS 2 (2015/863/EU)
CAS Accounted for Wt 92
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 7440-02-0
Supply Current-Max 0.45 mA

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