CY7C1471BV25-133AXCT
vs
GS8642V36E-300
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
GSI TECHNOLOGY
|
Package Description |
14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
|
BGA,
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
6.5 ns
|
5.5 ns
|
Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
133 MHz
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PQFP-G100
|
R-PBGA-B165
|
JESD-609 Code |
e3
|
|
Length |
20 mm
|
17 mm
|
Memory Density |
75497472 bit
|
75497472 bit
|
Memory IC Type |
ZBT SRAM
|
CACHE SRAM
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
165
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
2MX36
|
2MX36
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
BGA
|
Package Equivalence Code |
QFP100,.63X.87
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
235
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
|
Standby Voltage-Min |
2.38 V
|
|
Supply Current-Max |
0.305 mA
|
|
Supply Voltage-Max (Vsup) |
2.625 V
|
2 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
1.6 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.65 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
14 mm
|
15 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
165
|
|
|
|
Compare CY7C1471BV25-133AXCT with alternatives
Compare GS8642V36E-300 with alternatives