CY7C1470V33-250BZC
vs
GS8640E36GT-200IV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
GSI TECHNOLOGY
Part Package Code
BGA
QFP
Package Description
LBGA, BGA165,11X15,40
LQFP,
Pin Count
165
100
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3 ns
7.5 ns
Additional Feature
PIPELINED ARCHITECTURE
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
R-PQFP-G100
JESD-609 Code
e0
e3
Length
17 mm
20 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
ZBT SRAM
CACHE SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
165
100
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LQFP
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.6 mm
Standby Voltage-Min
3.14 V
Supply Voltage-Max (Vsup)
3.63 V
2 V
Supply Voltage-Min (Vsup)
3.135 V
1.7 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
14 mm
Base Number Matches
1
1
Pbfree Code
Factory Lead Time
24 Weeks
Compare CY7C1470V33-250BZC with alternatives
Compare GS8640E36GT-200IV with alternatives