CY7C1470V33-167BZXC
vs
CY7C1470BV33-167BZXCT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
|
Package Description |
15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165
|
15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, , FBGA-165
|
Pin Count |
165
|
|
Reach Compliance Code |
unknown
|
compliant
|
Access Time-Max |
3.4 ns
|
3.4 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
JESD-609 Code |
e1
|
e1
|
Length |
17 mm
|
17 mm
|
Memory Density |
75497472 bit
|
75497472 bit
|
Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
NOT SPECIFIED
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
165
|
165
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
2MX36
|
2MX36
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
20
|
Width |
15 mm
|
15 mm
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
Clock Frequency-Max (fCLK) |
|
167 MHz
|
I/O Type |
|
COMMON
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
BGA165,11X15,40
|
Standby Voltage-Min |
|
3.14 V
|
Supply Current-Max |
|
0.45 mA
|
Technology |
|
CMOS
|
|
|
|
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