CY7C1470BV33-250BZXC
vs
K7N641845M-QI250
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
|
LQFP, QFP100,.63X.87
|
| Pin Count |
165
|
100
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
3 ns
|
2.6 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
250 MHz
|
250 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PBGA-B165
|
R-PQFP-G100
|
| JESD-609 Code |
e1
|
e0
|
| Length |
17 mm
|
20 mm
|
| Memory Density |
75497472 bit
|
75497472 bit
|
| Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
| Memory Width |
36
|
18
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
100
|
| Number of Words |
2097152 words
|
4194304 words
|
| Number of Words Code |
2000000
|
4000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
2MX36
|
4MX18
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LQFP
|
| Package Equivalence Code |
BGA165,11X15,40
|
QFP100,.63X.87
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.6 mm
|
| Standby Voltage-Min |
3.14 V
|
2.38 V
|
| Supply Current-Max |
0.5 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
15 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CY7C1470BV33-250BZXC with alternatives
Compare K7N641845M-QI250 with alternatives