CY7C1395V25-133AC
vs
GS8641V36GF-300T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
GSI TECHNOLOGY
Part Package Code
QFP
BGA
Package Description
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
BGA,
Pin Count
100
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.2 ns
5.5 ns
Additional Feature
PIPELINE ARCHITECTURE
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
JESD-30 Code
R-PQFP-G100
R-PBGA-B165
JESD-609 Code
e0
e1
Length
20 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
ZBT SRAM
CACHE SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
100
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX36
2MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
BGA
Package Equivalence Code
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Standby Current-Max
0.02 A
Standby Voltage-Min
2.38 V
Supply Current-Max
0.2 mA
Supply Voltage-Max (Vsup)
2.625 V
2 V
Supply Voltage-Min (Vsup)
2.375 V
1.6 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
Terminal Position
QUAD
BOTTOM
Width
14 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
260
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Compare GS8641V36GF-300T with alternatives