CY7C1392CV18-250BZXI
vs
GS8182S08BGD-250I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
End Of Life
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
GSI TECHNOLOGY
|
Part Package Code |
BGA
|
BGA
|
Package Description |
13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
|
LBGA,
|
Pin Count |
165
|
165
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.B
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
0.45 ns
|
0.45 ns
|
Clock Frequency-Max (fCLK) |
250 MHz
|
|
I/O Type |
SEPARATE
|
|
JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
JESD-609 Code |
e1
|
e1
|
Length |
15 mm
|
15 mm
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
DDR SRAM
|
DDR SRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
165
|
165
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
2MX8
|
2MX8
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA165,11X15,40
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Standby Current-Max |
0.255 A
|
|
Standby Voltage-Min |
1.7 V
|
|
Supply Current-Max |
0.7 mA
|
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
13 mm
|
13 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Additional Feature |
|
PIPELINED ARCHITECTURE
|
|
|
|
Compare CY7C1392CV18-250BZXI with alternatives
Compare GS8182S08BGD-250I with alternatives