CY7C1386FV25-250BGI vs MT58LC128K36C5LG-8TR feature comparison

CY7C1386FV25-250BGI Cypress Semiconductor

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MT58LC128K36C5LG-8TR Micron Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP MICRON TECHNOLOGY INC
Part Package Code BGA QFP
Package Description 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 LQFP,
Pin Count 119 100
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2.6 ns 8 ns
Additional Feature PIPELINED ARCHITECTURE AUTOMATIC POWER-DOWN
JESD-30 Code R-PBGA-B119 R-PQFP-G100
JESD-609 Code e0 e0
Length 22 mm 20 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX36 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.6 mm
Supply Voltage-Max (Vsup) 2.625 V 3.6 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES

Compare CY7C1386FV25-250BGI with alternatives

Compare MT58LC128K36C5LG-8TR with alternatives