CY7C1386FV25-250BGI
vs
MT58LC128K36C5LG-8TR
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
MICRON TECHNOLOGY INC
|
Part Package Code |
BGA
|
QFP
|
Package Description |
14 X 22 MM, 2.40 MM HEIGHT, BGA-119
|
LQFP,
|
Pin Count |
119
|
100
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
2.6 ns
|
8 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
AUTOMATIC POWER-DOWN
|
JESD-30 Code |
R-PBGA-B119
|
R-PQFP-G100
|
JESD-609 Code |
e0
|
e0
|
Length |
22 mm
|
20 mm
|
Memory Density |
18874368 bit
|
4718592 bit
|
Memory IC Type |
CACHE SRAM
|
STANDARD SRAM
|
Memory Width |
36
|
36
|
Number of Functions |
1
|
1
|
Number of Terminals |
119
|
100
|
Number of Words |
524288 words
|
131072 words
|
Number of Words Code |
512000
|
128000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512KX36
|
128KX36
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LQFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.4 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
2.625 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
Number of Ports |
|
1
|
Output Characteristics |
|
3-STATE
|
Output Enable |
|
YES
|
|
|
|
Compare CY7C1386FV25-250BGI with alternatives
Compare MT58LC128K36C5LG-8TR with alternatives