CY7C1386FV25-250BGI vs CY7C1317V18-250BZC feature comparison

CY7C1386FV25-250BGI Cypress Semiconductor

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CY7C1317V18-250BZC Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Pin Count 119 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2.6 ns 0.35 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B165
JESD-609 Code e0 e0
Length 22 mm 15 mm
Memory Density 18874368 bit 16777216 bit
Memory IC Type CACHE SRAM DDR SRAM
Memory Width 36 8
Number of Functions 1 1
Number of Terminals 119 165
Number of Words 524288 words 2097152 words
Number of Words Code 512000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX36 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.625 V 1.9 V
Supply Voltage-Min (Vsup) 2.375 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 13 mm
Base Number Matches 1 1
Pbfree Code No
Clock Frequency-Max (fCLK) 250 MHz
I/O Type COMMON
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Peak Reflow Temperature (Cel) 220
Standby Voltage-Min 1.7 V

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