CY7C1381D-133BGI vs CY7C1381D-133BGC feature comparison

CY7C1381D-133BGI Cypress Semiconductor

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CY7C1381D-133BGC Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 14 X 22 MM, 2.40 MM HEIGHT, BGA-119
Pin Count 119 119
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6.5 ns 6.5 ns
Additional Feature FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX36 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare CY7C1381D-133BGI with alternatives

Compare CY7C1381D-133BGC with alternatives