CY7C1372AV25-100BGC
vs
CY7C1306V25-100BZC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Pin Count
119
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5 ns
3 ns
Clock Frequency-Max (fCLK)
100 MHz
100 MHz
I/O Type
COMMON
SEPARATE
JESD-30 Code
R-PBGA-B119
R-PBGA-B165
JESD-609 Code
e0
e0
Length
22 mm
15 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
ZBT SRAM
QDR SRAM
Memory Width
18
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
119
165
Number of Words
1048576 words
524288 words
Number of Words Code
1000000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX18
512KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Equivalence Code
BGA119,7X17,50
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
220
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
1.2 mm
Standby Current-Max
0.03 A
0.06 A
Standby Voltage-Min
2.38 V
2.4 V
Supply Current-Max
0.25 mA
0.33 mA
Supply Voltage-Max (Vsup)
2.625 V
2.6 V
Supply Voltage-Min (Vsup)
2.375 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
13 mm
Base Number Matches
1
1
Additional Feature
PIPELINED ARCHITECTURE
Compare CY7C1372AV25-100BGC with alternatives
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