We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

CY7C1370D-200BZC vs CY7C1370C-200BZC feature comparison

CY7C1370D-200BZC Cypress Semiconductor

Buy Now Datasheet

CY7C1370C-200BZC Cypress Semiconductor

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Pin Count 165 165
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3 ns 3 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz 200 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e0
Length 15 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX36 512KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA TBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Standby Current-Max 0.07 A 0.06 A
Standby Voltage-Min 3.14 V 3.14 V
Supply Current-Max 0.3 mA 0.3 mA
Supply Voltage-Max (Vsup) 3.6 V 3.63 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1
Memory » SRAMs
Memory » SRAMs

Compare CY7C1370D-200BZC with alternatives

Compare CY7C1370C-200BZC with alternatives