CY7C1370D-200BGC
vs
K7N163601A-HC20
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
(14 X 22 X 2.4) MM, PLASTIC, BGA-119
BGA,
Pin Count
119
119
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3 ns
3.2 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX36
512KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
Standby Current-Max
0.07 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.3 mA
Supply Voltage-Max (Vsup)
3.6 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
1
1
Compare CY7C1370D-200BGC with alternatives
Compare K7N163601A-HC20 with alternatives