CY7C1370D-167BGIT
vs
CY7C1370C-200BGC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
(14 X 22 X 2.4) MM, PLASTIC, BGA-119
14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
Pin Count
119
119
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.4 ns
3 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
e0
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX36
512KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
2.4 mm
Supply Voltage-Max (Vsup)
3.6 V
3.63 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Rohs Code
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Standby Current-Max
0.06 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.3 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare CY7C1370D-167BGIT with alternatives
Compare CY7C1370C-200BGC with alternatives