CY7C1356A-133BGCI vs K7N801801M-HC13 feature comparison

CY7C1356A-133BGCI Cypress Semiconductor

Buy Now Datasheet

K7N801801M-HC13 Samsung Semiconductor

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 BGA,
Pin Count 119 119
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 4.2 ns 4.2 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0
Length 22 mm 22 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX18 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.41 mA
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 2

Compare CY7C1356A-133BGCI with alternatives

Compare K7N801801M-HC13 with alternatives