CY7C1354CV25-167AXC vs CY7C1356V25-133BAC feature comparison

CY7C1354CV25-167AXC Cypress Semiconductor

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CY7C1356V25-133BAC Cypress Semiconductor

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 4.2 ns
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B119
JESD-609 Code e3 e0
Memory Density 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 36 18
Moisture Sensitivity Level 3
Number of Terminals 100 119
Number of Words 262144 words 524288 words
Number of Words Code 256000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX36 512KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP BGA
Package Equivalence Code QFP100,.63X.87 BGA119(UNSPEC)
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.035 A 0.01 A
Standby Voltage-Min 2.38 V 2.38 V
Supply Current-Max 0.18 mA 0.32 mA
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.635 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Base Number Matches 1 1
Part Package Code BGA
Package Description BGA-119
Pin Count 119
Number of Functions 1
Supply Voltage-Max (Vsup) 2.625 V
Supply Voltage-Min (Vsup) 2.375 V

Compare CY7C1354CV25-167AXC with alternatives

Compare CY7C1356V25-133BAC with alternatives