CY7C1345B-50AC
vs
MCM69L738ZP9R
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
QFP
Package Description
LQFP,
BGA,
Pin Count
100
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
11 ns
Additional Feature
SELF-TIMED WRITE
JESD-30 Code
R-PQFP-G100
JESD-609 Code
e0
Length
20 mm
Memory Density
4718592 bit
Memory IC Type
CACHE SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
100
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128KX36
Package Body Material
PLASTIC/EPOXY
Package Code
LQFP
Package Shape
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
QUAD
Width
14 mm
Base Number Matches
1
2
Compare CY7C1345B-50AC with alternatives
Compare MCM69L738ZP9R with alternatives