CY7C1327G-250AXC
vs
MCM63P819KTQ133
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
QFP
Package Description
14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100
PLASTIC, TQFP-100
Pin Count
100
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
2.6 ns
4 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
I/O Type
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e3
e0
Length
20 mm
20 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX18
256KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.04 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.325 mA
Supply Voltage-Max (Vsup)
3.63 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
14 mm
14 mm
Base Number Matches
2
2
Compare CY7C1327G-250AXC with alternatives
Compare MCM63P819KTQ133 with alternatives