CY7C1321V18-250BZC vs MCM69F817ZP7 feature comparison

CY7C1321V18-250BZC Cypress Semiconductor

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MCM69F817ZP7 Motorola Mobility LLC

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP MOTOROLA INC
Part Package Code BGA BGA
Package Description 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 BGA,
Pin Count 165 119
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.35 ns 7 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B119
JESD-609 Code e0 e0
Length 15 mm 22 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type DDR SRAM CACHE SRAM
Memory Width 36 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 165 119
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX36 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2.4 mm
Supply Voltage-Max (Vsup) 1.9 V 3.6 V
Supply Voltage-Min (Vsup) 1.7 V 3.135 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 14 mm
Base Number Matches 1 3
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES

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