CY7C1306AV25-167BZC
vs
MCM69F817ZP6.5R
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA, BGA165,11X15,40
|
BGA,
|
| Pin Count |
165
|
119
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
2.5 ns
|
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
|
| Clock Frequency-Max (fCLK) |
167 MHz
|
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-PBGA-B165
|
|
| JESD-609 Code |
e0
|
|
| Length |
15 mm
|
|
| Memory Density |
18874368 bit
|
|
| Memory IC Type |
QDR SRAM
|
|
| Memory Width |
36
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
165
|
|
| Number of Words |
524288 words
|
|
| Number of Words Code |
512000
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
512KX36
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Equivalence Code |
BGA165,11X15,40
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.4 mm
|
|
| Standby Current-Max |
0.47 A
|
|
| Standby Voltage-Min |
2.4 V
|
|
| Supply Current-Max |
0.75 mA
|
|
| Supply Voltage-Max (Vsup) |
2.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
13 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare CY7C1306AV25-167BZC with alternatives
Compare MCM69F817ZP6.5R with alternatives