CY7C1061AV33-10BAXI
vs
CY7C1061AV33-10BAC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
8 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-60
8 X 20 MM, 1.20 MM HEIGHT, FBGA-60
Pin Count
60
60
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
e0
Length
20 mm
20 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
60
60
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
1MX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.05 A
Standby Voltage-Min
3 V
Supply Current-Max
0.275 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
8 mm
8 mm
Base Number Matches
2
2
Pbfree Code
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