CY7C1041G30-10ZSXI
vs
CY7C1041CV33-10ZCT
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
TSOP2-44
|
TSOP2,
|
| Reach Compliance Code |
compliant
|
unknown
|
| Samacsys Manufacturer |
Infineon
|
|
| Access Time-Max |
10 ns
|
|
| Clock Frequency-Max (fCLK) |
100 MHz
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDSO-G44
|
|
| JESD-609 Code |
e3
|
|
| Length |
18.415 mm
|
|
| Memory Density |
4194304 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
|
| Memory Width |
16
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
44
|
|
| Number of Words |
262144 words
|
|
| Number of Words Code |
256000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256KX16
|
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSOP2
|
|
| Package Equivalence Code |
TSOP44,.46,32
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.194 mm
|
|
| Standby Current-Max |
0.008 A
|
|
| Standby Voltage-Min |
1 V
|
|
| Supply Current-Max |
0.045 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.2 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
10.16 mm
|
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
TSOP2
|
| Pin Count |
|
44
|
| ECCN Code |
|
3A991.B.2.A
|
| HTS Code |
|
8542.32.00.41
|
|
|
|
Compare CY7C1041G30-10ZSXI with alternatives
Compare CY7C1041CV33-10ZCT with alternatives