CY7C1021CV33-12BAC vs K6R1016V1C-FC120 feature comparison

CY7C1021CV33-12BAC Cypress Semiconductor

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K6R1016V1C-FC120 Samsung Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description TFBGA, BGA48,6X8,30 FBGA, BGA48,6X8,30
Pin Count 48
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B48 R-PBGA-B48
JESD-609 Code e0
Length 7 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1
Number of Terminals 48 48
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX16 64KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Equivalence Code BGA48,6X8,30 BGA48,6X8,30
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.005 A 0.005 A
Standby Voltage-Min 3 V 3 V
Supply Current-Max 0.085 mA 0.095 mA
Supply Voltage-Max (Vsup) 3.63 V
Supply Voltage-Min (Vsup) 2.97 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7 mm
Base Number Matches 2 1

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