CY7C09569V-83AXC
vs
CY7C056V-20AI
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
20 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-144
QFP,
Pin Count
144
144
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
18 ns
20 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
AUTOMATIC POWER DOWN; CONFIGURED AS 16K X 36
Clock Frequency-Max (fCLK)
83 MHz
I/O Type
COMMON
JESD-30 Code
S-PQFP-G144
S-PQFP-G144
JESD-609 Code
e3
e0
Length
20 mm
Memory Density
589824 bit
589824 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
9
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
144
144
Number of Words
16384 words
65536 words
Number of Words Code
16000
64000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
16KX36
64KX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Equivalence Code
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Standby Current-Max
0.001 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.36 mA
Supply Voltage-Max (Vsup)
3.465 V
3.45 V
Supply Voltage-Min (Vsup)
3.135 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
20 mm
Base Number Matches
2
1
Pbfree Code
No
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