CY7C09389V-9AXI
vs
IDT70V9189L9PF9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
LEAD FREE, PLASTIC, MS-026, TQFP-100
14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Pin Count
100
100
Reach Compliance Code
unknown
not_compliant
Factory Lead Time
4 Weeks
Access Time-Max
9 ns
20 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
FLOW THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e3
e0
Length
14 mm
14 mm
Memory Density
1179648 bit
589824 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
18
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX18
64KX9
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
14 mm
14 mm
Base Number Matches
2
1
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
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