CY7C09389V-7AC
vs
GS81032AT-150
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
GSI TECHNOLOGY
|
Part Package Code |
QFP
|
QFP
|
Package Description |
PLASTIC, MS-026, TQFP-100
|
LQFP,
|
Pin Count |
100
|
100
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
7.5 ns
|
9 ns
|
Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
JESD-30 Code |
S-PQFP-G100
|
R-PQFP-G100
|
JESD-609 Code |
e0
|
|
Length |
14 mm
|
20 mm
|
Memory Density |
1179648 bit
|
1048576 bit
|
Memory IC Type |
DUAL-PORT SRAM
|
CACHE SRAM
|
Memory Width |
18
|
32
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Number of Words |
65536 words
|
32768 words
|
Number of Words Code |
64000
|
32000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
64KX18
|
32KX32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LQFP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
220
|
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
3A991.B.2.B
|
HTS Code |
|
8542.32.00.41
|
|
|
|
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