CY7C09279V-12AC
vs
IDT707278L25PF
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
PLASTIC, MS-026, TQFP-100
14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Pin Count
100
100
Reach Compliance Code
unknown
not_compliant
Access Time-Max
12 ns
25 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e0
e0
Length
14 mm
14 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX16
32KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
220
240
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
14 mm
14 mm
Base Number Matches
2
1
ECCN Code
EAR99
HTS Code
8542.32.00.41
I/O Type
COMMON
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63SQ,20
Standby Current-Max
0.005 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.28 mA
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