CY7C0852V-133BBCT
vs
MCM63D736ATQ83
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
MOTOROLA INC
|
Part Package Code |
BGA
|
QFP
|
Package Description |
15 X 15 MM, 1.25 MM HEIGHT, 1 MM PITCH, FBGA-172
|
LFQFP, QFP176,1.0SQ,20
|
Pin Count |
172
|
176
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
4.4 ns
|
6 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK) |
133 MHz
|
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PBGA-B172
|
S-PQFP-G176
|
JESD-609 Code |
e0
|
e0
|
Length |
15 mm
|
24 mm
|
Memory Density |
4718592 bit
|
4718592 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
172
|
176
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
128KX36
|
128KX36
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LFQFP
|
Package Equivalence Code |
BGA172,14X14,40
|
QFP176,1.0SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.25 mm
|
1.6 mm
|
Standby Current-Max |
0.075 A
|
0.1 A
|
Standby Voltage-Min |
3.14 V
|
3.14 V
|
Supply Current-Max |
0.3 mA
|
0.325 mA
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
15 mm
|
24 mm
|
Base Number Matches |
1
|
4
|
|
|
|
Compare CY7C0852V-133BBCT with alternatives
Compare MCM63D736ATQ83 with alternatives