CY7C0852V-133BBC
vs
CY7C0852AV-133AXCT
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
FBGA-172
|
24 X 24 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-176
|
| Pin Count |
172
|
176
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
4.4 ns
|
4.4 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
133 MHz
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-PBGA-B172
|
S-PQFP-G176
|
| JESD-609 Code |
e0
|
|
| Length |
15 mm
|
24 mm
|
| Memory Density |
4718592 bit
|
4718592 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
36
|
36
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
172
|
176
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
128KX36
|
128KX36
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LFQFP
|
| Package Equivalence Code |
BGA172,14X14,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
220
|
250
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.25 mm
|
1.6 mm
|
| Standby Current-Max |
0.075 A
|
|
| Standby Voltage-Min |
3.14 V
|
|
| Supply Current-Max |
0.3 mA
|
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
15 mm
|
24 mm
|
| Base Number Matches |
2
|
1
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare CY7C0852V-133BBC with alternatives
Compare CY7C0852AV-133AXCT with alternatives