CY7C0851AV-133BBC
vs
CY7C0851V25-100BBC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
15 X 15 MM, 1.25 MM HEIGHT, 1 MM PITCH, FBGA-172
15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, FBGA-172
Pin Count
172
172
Reach Compliance Code
unknown
compliant
Access Time-Max
4 ns
5 ns
Additional Feature
PIPELINED ARCHITECTURE
JESD-30 Code
S-PBGA-B172
S-PBGA-B172
JESD-609 Code
e0
e0
Length
15 mm
15 mm
Memory Density
2359296 bit
2359296 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
172
172
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
64KX36
64KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
220
NOT SPECIFIED
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.25 mm
1.25 mm
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
15 mm
15 mm
Base Number Matches
2
1
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
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