CY7C0850V-133BBI
vs
CY7C057V-12BBC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
15 X 15 MM, 1.25 MM HEIGHT, 1 MM PITCH, FBGA-172
15 X 15 MM, 1.25 MM HEIGHT, 1 MM PITCH, BGA-172
Pin Count
172
172
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
4.4 ns
12 ns
Additional Feature
PIPELINED ARCHITECTURE
AUTOMATIC POWER-DOWN
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
JESD-30 Code
S-PBGA-B172
S-PBGA-B172
JESD-609 Code
e0
e0
Length
15 mm
15 mm
Memory Density
1179648 bit
1179648 bit
Memory IC Type
MULTI-PORT SRAM
DUAL-PORT SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
172
172
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX36
32KX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA172,14X14,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
220
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.25 mm
1.25 mm
Standby Voltage-Min
3.14 V
Supply Current-Max
0.3 mA
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
15 mm
15 mm
Base Number Matches
1
2
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