CY7C0430BV-100BGC
vs
CY7C0430BV-100BGIT
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272
27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272
Pin Count
272
272
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5 ns
5 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
I/O Type
COMMON
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e0
e0
Length
27 mm
27 mm
Memory Density
1179648 bit
1179648 bit
Memory IC Type
MULTI-PORT SRAM
FOUR-PORT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
4
Number of Terminals
272
272
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
64KX18
64KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA272,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.46 mm
2.46 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
3.15 V
Supply Current-Max
0.55 mA
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
27 mm
27 mm
Base Number Matches
1
2
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Compare CY7C0430BV-100BGIT with alternatives