CY7B210-30WI
vs
AM27C1024-170LC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
LCC
Package Description
DIP,
WQCCN, LCC44,.65SQ
Pin Count
40
44
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
30 ns
170 ns
Additional Feature
POWER DOWN PROM
JESD-30 Code
R-GDIP-T40
S-CQCC-N44
JESD-609 Code
e0
e0
Memory Density
1048576 bit
1048576 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
40
44
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX16
64KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
WQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
BICMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Position
DUAL
QUAD
Base Number Matches
1
1
I/O Type
COMMON
Length
16.51 mm
Package Equivalence Code
LCC44,.65SQ
Seated Height-Max
3.556 mm
Standby Current-Max
0.0002 A
Supply Current-Max
0.05 mA
Terminal Pitch
1.27 mm
Width
16.51 mm
Compare CY7B210-30WI with alternatives
Compare AM27C1024-170LC with alternatives