CY7B201-30WMB vs IS27HC010-30TI feature comparison

CY7B201-30WMB Cypress Semiconductor

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IS27HC010-30TI Integrated Silicon Solution Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP INTEGRATED SILICON SOLUTION INC
Part Package Code DIP TSOP
Package Description 0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 TSOP-32
Pin Count 32 32
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 30 ns 30 ns
Additional Feature POWER DOWN PROM
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T32 R-PDSO-G32
JESD-609 Code e0 e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSOP1
Package Equivalence Code DIP32,.3 TSSOP32,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 0.06 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BICMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Length 18.4 mm
Seated Height-Max 1.2 mm
Standby Current-Max 0.00005 A
Width 8 mm

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