CY7B173-14LC
vs
HM62D932LJP-20
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
RENESAS ELECTRONICS CORP
Part Package Code
LCC
SOJ
Package Description
CERAMIC, LCC-44
SOJ,
Pin Count
44
32
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
14 ns
20 ns
Additional Feature
SELF-TIMED WRITE
ADDRESS LATCH
I/O Type
COMMON
JESD-30 Code
S-CQCC-N44
R-PDSO-J32
JESD-609 Code
e0
Length
16.51 mm
20.71 mm
Memory Density
294912 bit
294912 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
9
9
Number of Functions
1
1
Number of Ports
1
Number of Terminals
44
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX9
32KX9
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
SOJ
Package Equivalence Code
LCC44,.65SQ
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
3.76 mm
Supply Current-Max
0.25 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
DUAL
Width
16.51 mm
7.62 mm
Base Number Matches
1
2
Compare CY7B173-14LC with alternatives
Compare HM62D932LJP-20 with alternatives