CY74FCT827ATQC
vs
PI74FCT827DTQX
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
PERICOM SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
0.150 INCH, QSOP-24
|
SSOP,
|
Pin Count |
24
|
24
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
WITH DUAL OUTPUT ENABLE
|
WITH DUAL OUTPUT ENABLE
|
Control Type |
ENABLE LOW
|
|
Family |
FCT
|
FCT
|
JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
JESD-609 Code |
e0
|
e0
|
Length |
8.65 mm
|
8.65 mm
|
Load Capacitance (CL) |
300 pF
|
50 pF
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Max I(ol) |
0.064 A
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
10
|
10
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SSOP
|
Package Equivalence Code |
SSOP24,.24
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Prop. Delay@Nom-Sup |
8 ns
|
|
Propagation Delay (tpd) |
15 ns
|
7.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
3.9116 mm
|
Base Number Matches |
3
|
1
|
ECCN Code |
|
EAR99
|
|
|
|
Compare CY74FCT827ATQC with alternatives
Compare PI74FCT827DTQX with alternatives