CY74FCT2573ATQCT
vs
IDT74FCT2573TQ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QSOP
QSOP
Package Description
0.150 INCH, QSOP-20
QSOP-20
Pin Count
20
20
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
BROADSIDE VERSION OF 2373
BROADSIDE VERSION OF 2373
Family
FCT
FCT
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
e0
Length
8.65 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.012 A
0.012 A
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE WITH SERIES RESISTOR
3-STATE WITH SERIES RESISTOR
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SSOP20,.25
SSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Packing Method
TR
Prop. Delay@Nom-Sup
5.2 ns
8 ns
Propagation Delay (tpd)
8.5 ns
13 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9116 mm
Base Number Matches
2
2
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
20
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