CY62256V25-70SNC
vs
BQ4011LYMA-70N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
MODULE
Package Description
0.300 INCH, SOIC-28
ROHS COMPLIANT, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G28
R-PDMA-P28
JESD-609 Code
e0
Length
18.39 mm
37.72 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
CACHE SRAM
NON-VOLATILE SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP28,.5
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.794 mm
9.53 mm
Standby Current-Max
0.0001 A
0.001 A
Standby Voltage-Min
2.3 V
Supply Current-Max
0.03 mA
0.03 mA
Supply Voltage-Max (Vsup)
2.7 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
3 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
PIN/PEG
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
18.415 mm
Base Number Matches
1
1
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare CY62256V25-70SNC with alternatives
Compare BQ4011LYMA-70N with alternatives