CY62167DV20L-70BVI
vs
MB82D01171A-80PBT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
FUJITSU LTD
Part Package Code
BGA
Package Description
8 X 9.50 MM, 1 MM HEIGHT, VFBGA-48
TFBGA, BGA48,6X8,32
Pin Count
48
Reach Compliance Code
unknown
compliant
Access Time-Max
70 ns
80 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
9.5 mm
9 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-30 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Supply Voltage-Max (Vsup)
2.2 V
2.7 V
Supply Voltage-Min (Vsup)
1.65 V
2.3 V
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
6 mm
Base Number Matches
2
2
Rohs Code
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Additional Feature
ALSO OPERATES AT 2.7V TO 3.1V SUPPLY
I/O Type
COMMON
JESD-609 Code
e0
Memory Width
16
Output Characteristics
3-STATE
Package Equivalence Code
BGA48,6X8,32
Standby Current-Max
0.0002 A
Supply Current-Max
0.025 mA
Terminal Finish
TIN LEAD
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